Custom Semiconductor Precision Components
For semiconductor test fixtures, precision brackets, and micro-components, we offer 5-axis CNC milling and turning-milling hybrid machining. Supports stainless steel, titanium, and high-performance engineering plastics. Tolerance controlled to ±0.01mm, Ra0.4μm high gloss finish, ensuring cleanliness and assembly precision.
Specifications and Machining Capabilities
Core advantage is GD&T control at extremely small sizes. 5-axis simultaneous machining solves deep cavities and multi-angle hole challenges, avoiding cumulative errors from multiple fixturing.
- Minimum shaft diameter 0.2mm, length-to-diameter ratio up to 1:30
- Critical mating surfaces hardness HRC50-55, wear and corrosion resistant
- Complex surfaces Ra0.2μm mirror finish, no chatter marks
Cleanliness and Batch Consistency
Semiconductor components are sensitive to surface residues. Post-machining ultrasonic degreasing ensures no chips, oil, or metal ion residues. First-article inspection and process full inspection ensure batch appearance and dimensional consistency, preventing assembly interference.
- Equipped with CMM and roughness meters for full dimensional inspection
- Incoming material spectroscopic analysis, material reports provided
- Independent clean packaging, anti-static dust-proof transport
How long is the prototyping cycle?
Standard sizes 3-5 days, complex structures within 7 days, rush scheduling supported to meet project milestones.
What tolerances can be achieved?
Standard tolerance ±0.01mm, critical precision mating surfaces up to ±0.01mm, based on drawing structure evaluation.
Send drawings for DFM suggestions and quotes, quickly start your semiconductor component mass production plan.
