Semi-conductor custom precision components
For semiconductor test fixtures, precision holders and microstructural components, we offer 5-axis CNC milling and turning-milling combined machining. Supports stainless steel, titanium alloy and high-performance engineering plastics, tolerances controlled at ±0.01mm, Ra0.4μm high finish, ensuring cleanliness and assembly precision.
Specifications and machining capabilities
The core advantage is positional tolerance control at very small sizes. 5-axis simultaneous machining solves deep cavities and multi-angle hole challenges, avoiding cumulative errors from multiple clamping.
- Minimum axis diameter 0.2mm, length-to-diameter ratio up to 1:30
- Key fitting surfaces hardness HRC50-55, wear- and corrosion-resistant
- Complex curved surfaces Ra0.2μm mirror finish, no chatter marks
Cleanliness and batch consistency
Semiconductor components are highly sensitive to surface residues. Post-machining ultrasonic degreasing ensures no chips, no oil, no metal ion residue. First-article approval and 100% process inspection guarantee batch appearance and dimensional consistency, preventing assembly interference.
- Equipped with 3D CMM and roughness meter for full dimensional inspection
- Incoming material spectral analysis, material report provided with delivery
- Independent clean packaging, anti-static dust-proof transport
How long is the sampling cycle?
Standard sizes 3-5 days, complex structures within 7 days, rush production supported to align with project milestones.
What tolerances can be achieved?
Standard tolerance ±0.01mm, key precision fitting surfaces up to ±0.01mm, specific evaluation based on drawing structure.
Send drawings for DFM advice and quote, quickly launch your semiconductor component mass production plan.




























































